With the development of electronic information products in the direction of digitization, networking, integration and portability, composite components and integrated passive components have become the main direction of the development of electronic components. In the face of fierce international competition, China's electronic component companies must rely on independent innovation to upgrade their technological level, thereby enhancing their core competitiveness.
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The information industry is facing new development opportunities. Digital TV, next-generation mobile communications, next-generation Internet industrialization, new flat panel display, automotive electronics and other applications have provided a huge market for the development of electronic components as one of the core industries of the information industry. Opportunities will also face fierce international competition.
Independent innovation to improve industrial technology level
National Development and Reform Commission "Eleventh Five-Year" high-tech industrial development planning and information industry "Eleventh Five-Year Plan", information industry science and technology development "Eleventh Five-Year Plan" and 2020 medium- and long-term planning outline, especially electronic basic materials and key components " The Eleventh Five-Year Special Plan is guiding the component industry to strengthen independent innovation, improve industrial technology and improve international competitiveness, focusing on the development of high-end chip components, medium and high-end electromechanical components, new power electronic devices, new green batteries, sensitive components and Sensors, high-end optoelectronic devices and materials, miniaturized high-frequency frequency devices, components and key infrastructure materials, environmentally-friendly high-density multilayer interconnected printed circuit boards, flexible circuit boards and key raw materials and hybrid integrated circuits, etc., by 2010, new The scale of electronic information core industries such as components has quadrupled, and some key technologies have achieved breakthroughs. The domestic supporting capacity of components, materials and special equipment has been significantly enhanced. With the development of electronic whole machines in the direction of digitization, multi-function and miniaturization, electronic systems are developing in the direction of networking, high-speed and broadband, and new components will be miniaturized, sliced, high-performance, and integrated. Intelligent, environmentally friendly and energy-saving development. Micro-small and chip-based technology, passive integration technology, anti-electromagnetic interference technology, low-temperature co-fired ceramic technology, and green production technology have become the focus of technological advancement in the industry. The rapid development of microelectromechanical systems (MEMS) and micro-assembly technology will greatly enhance the function and performance of components.
In the face of opportunities and challenges, technological innovation determines the share of emerging markets. Whoever can seize the commanding heights of new materials, new technologies, and new processes will win the dominance of emerging markets. In the electronic components industry, product replacement is accelerating, and alternative competition for different products is accelerating. If companies engaged in electronic components do not understand the upgrading of their products, they may lead to bankruptcy. For example, a factory in Jiangxi Province introduced the first generation of piezoelectric ceramic filters from Murata. Due to the lack of understanding of the upgrading of products, blind investment of nearly 50 million yuan to expand the economic scale of backward products, the result of the new production line ribbon-cutting day became the factory closed At the same time, the third-generation piezoelectric ceramic filter introduced by Murata of Japan has better performance and cheaper price, and quickly occupied most of the Chinese color TV market.
Due to the acceleration of the internationalization process in the Chinese market, the sunset products that lack international competitiveness in the component industry are not at a loss sales, or the market is rapidly shrinking, and the component industry enterprises will face a new round of reshuffle. In order to have a foothold in the international component market, entrepreneurs in the component industry must have an international business strategy, and strive to become a top international manufacturer, relying on technological innovation to improve the international competitiveness of core technology, introducing, digesting, absorbing, and re- Create, form a world-class technology and technology platform and scientific management system, attract world-class technology and management talents, and make the industry bigger and stronger.
Energy conservation, material saving, green, and environmental protection have also become an irresistible trend in the development of the component industry. The EU RoHS, which was promulgated on February 13, 2003, was transferred to EU regulations on August 13, 2004, and was implemented on July 1, 2006. China’s February 28, 2006, "Administrative Measures on Pollution Control of Electronic Information Products" It will take effect on March 1, 2007. China's electronic component companies should respond positively from the perspective of corporate sustainable development or corporate social responsibility, or from the market access perspective of products. Whoever takes the lead and who takes the initiative, this is an important part of technological innovation, energy conservation. , material, green, and environmental protection will become an unstoppable trend in the development of the component industry.
Chip component innovation never stops
Chip-type general-purpose components mainly include chip capacitors, chip resistors, and chip inductors. Capacitors are developing in the direction of chip formation, compositing and high performance, and new requirements are constantly being placed on materials. The successful development of new materials has driven the development of new capacitors. The chip resistors can be classified into thick film chip resistors and film chip resistors according to the film forming process. The former conductive material is mainly ruthenium oxide, the film forming process is printing, and the latter conductive material is nickel chrome. The membrane process is evaporation or sputtering. Thick film chip resistors have two disadvantages, namely, the resistance accuracy is relatively high and the temperature coefficient is relatively large. In order to meet the requirements of high precision and low temperature coefficient, the film chip resistor with nickel chromium as the resistive film is currently abroad. Energy production, resistance range from tens of milliohms to hundreds of megaohms, temperature coefficient from ± 300ppm ° C to ± 5ppm ° C, accuracy from ± 5% to ± 0.01%, to meet the requirements of different electronic equipment. The high performance of chip inductors is mainly high frequency, high Q, large inductance, and large current. For example, TDK has successfully developed SMD (Surface Mount) power inductors with inductances up to mH and currents up to several amperes. Murata uses LTCC (Low Temperature Co-fired Ceramics) technology and thin film technology, based on ceramics, made into a chip inductor 0.6mm × 0.3mm × 0.3mm, inductance up to 15nH, 1.8GHz, Q30.
The main trends in the development of chip-type sensitive components and sensor technology are intelligent, miniaturization, integrated compositing, digitization, low power consumption, chip, and array. For example, surface mount type (SMD) thermistors have the advantages of small volume, small thermal time constant, good interchangeability, stable performance, high reliability, etc., and are suitable for overheat protection of cadmium nickel, nickel hydrogen, and lithium ion rechargeable batteries. Electronic circuits, liquid crystal displays and crystal oscillators for temperature compensation, DCDC (DC) power modules and microwave power amplifiers for overheat protection and computer and camera motor speed control.
With the continuous improvement of the processing level of crystal resonators, crystal resonators have realized the design and production of SMD. At present, the size of domestic SMD is 7mm × 5mm × 1.8mm, 6mm × 3.5mm × 1.2mm and 3.2mm × 2.5mm × 1.2mm, while foreign companies have introduced 3.2mm × 2.5mm × 1.2mm, 2.5mm × 2.0 Ultra-small SMD crystal resonators such as mm × 0.5 mm and 2.0 mm × 1.6 mm × 0.45 mm. While perfecting and improving the resonator process, high-quality quartz crystal materials that have been electrically cleaned by high temperature and high voltage have been widely used in recent years, which further improves the Q value of the crystal resonator and reduces the chance of spurs in the resonator. . Due to the limitation of processing level, the maximum frequency of the fundamental frequency quartz plate processed by mechanical grinding can only reach 60MHz. It is a problem to produce quartz wafer with higher fundamental frequency. At present, most of the methods are ion etching or chemical etching. achieve.
Low voltage, low power consumption, miniaturization, SMD, low phase noise, and high frequency are the directions of TCXO (temperature compensated crystal oscillator). With the maturity of professional integrated chips and the development of packaging technology, the volume of foreign TCXO is developing in the direction of miniaturization. At present, SMD temperature-compensated crystal oscillators of 3.2 mm × 2.5 mm × 1.2 mm have been widely used in civilian mobile phones. The frequency of the temperature compensated crystal oscillator can be as high as 300MHz to 500MHz through a phase-locked multiplier circuit.
Integrating passive components into industrial hotspots
With the development of electronic information products in the direction of digitization, networking, integration and portability, composite components and integrated passive components have become the main direction of the development of electronic components. Multi-layer ceramic technology and low-temperature co-firing technology have become passive. The mainstream technology of multi-layered components, multi-layer component chipping, chip component integration, and functional component compounding and modularization. Compounding and integration are the best solutions to reduce the cost of installing passive components. At the same time, due to the reduction of solder joints and wiring, product reliability and digital circuit operation speed can be improved.
With the high frequency of wireless communication and the high speed of data processing, microwave component technology has become a hot spot.
The RFI (Radio Frequency Interference) / EMI (Electromagnetic Interference) suppression filter is the most effective means of suppressing conducted disturbances, including signal line EMI filters and power line EMI filters. The signal line filter allows the useful signal to pass without attenuation while greatly attenuating the clutter disturbance signal. Power line filter, also known as power supply noise filter, transmits DC, 50Hz or 400Hz power to the device with less attenuation, but greatly attenuates the EMI signal transmitted through the power supply to protect the device from damage. It can also suppress the EMI signal generated by the device itself, prevent it from entering the power grid, pollute the electromagnetic environment, and harm other devices. The surface mount EMI filter is a low pass filter that is especially suitable for high frequency oscillation noise suppression. The surface mount noise is significantly improved by the surface mount EMI filter that can be mounted on the printed board next to the crystal oscillator and power amplifier.
The LC composite band-pass filter and the switched capacitor array filter are combined with a lumped-parameter LC element, and are easy to realize a medium-bandwidth (2% to 20%) band-pass filter below 1 GHz, which has low cost, small size, and simple process. advantage. With the appropriate circuit topology, it is easy to integrate with LTCC technology. Resistor networks and capacitor networks will continue to shrink in size and further miniaturization. Improve accuracy, stability and reliability while miniaturizing. Using direct drawing technology instead of printing, plasma etching instead of traditional lithography, etc., developing a more stable and temperature coefficient thin film resistor network is a trend in the future, which can better meet the high precision and size of military and civilian equipment. Small, high stability, high reliability and other requirements.
Integrated passive components are the second largest application area for LTCC technology. The LTCC technology is to cast a low-temperature sintered ceramic dielectric powder into a precise and dense green porcelain strip. The capacitor electrode is fabricated on the green porcelain strip by laser drilling, microporous grouting, precision screen printing of the conductor paste, and the like. The planar inductor and the transmission line are then laminated together and fired at a low temperature (about 900 ° C) to form an integrated passive component or a multilayer ceramic substrate with IC (integrated circuit) and active devices mounted on the surface. , made into an integrated function module. The integrated passive component technology is suitable for high-performance and miniaturization requirements of RF, high-speed digital electronic products and optoelectronic applications. It is innovative and high based on microwave ceramic dielectric material technology, multilayer ceramic processing technology and hybrid microelectronic technology. Density and microsystem solutions are the mainstream technologies for the development of passive components from chip to integration. The performance is more reliable, the assembly cost is lower, and the price is cheaper.
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