[Text / high-tech LED Yue Mengdi] "fast speed, high precision, this is the biggest advantage of our equipment." The head of the marketing department of Dazu Optoelectronics once said at the Guangbo Fair on "High-tech LED".
Dazu Optoelectronic Equipment Co., Ltd. was established by Han's Laser Technology Industry Group Co., Ltd. The company mainly has "HAN'S" series high-speed screen solid crystal machine, high-speed automatic in-line wire bonding machine, high-speed SMD beam splitter, high-speed SMD tape. Machine and other products. In the LED industry has a certain reputation, and HAN'S 5201S is the main wire bonding machine of Dazu Optoelectronics this year.
According to the research of the High-tech Research Institute LED Research Institute (GGII), the localization rate of newly added equipment for the back-end spectroscopic tape machine is over 95%; the localization rate of new equipment for dispensers and solid crystal machines exceeds 70%, and the welding line The rate of newly added equipment is relatively low. In terms of domestic wire bonding machines, the market share of manufacturers represented by Dazu Laser and Cui Tao is only about 15%.
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In fact, wire bonding equipment is a combination of high productivity and high precision. Wire bonding technology includes thermal ultrasonic, motion control (multi-axis synchronization), optical identification and positioning, high-voltage electronic ignition and non-stick detection, temperature control and other key technologies. Among the latest products that Dazu Optoelectronics pushed this year, the high-speed automatic SMD gold wire bonding machine is the most complicated and technically difficult. In the release of new high-speed automatic wire bonding machine models, including the straight wire bonding machine HANS-5111, as well as HANS-LINE solid crystal welding line automatic production line.
Among them, as one of the main models of Dazu Optoelectronics in the second half of the year, the cost performance of HANS-5201s mainstream models is relatively high, and the wire bonding cycle can reach 48ms/line.
With the development of packaging technology, packaging equipment is also constantly updated. When talking about the hot flip-chip package in the market, will it affect the wire bonding machine? The people of the Dazu Optoelectronics Market Department believe that the flip-chip is not popular at present, but it will take time to test and precipitate to become the mainstream of the market. The wire bonding machine cannot be eliminated. "Of course, keeping up with market changes and keeping pace with the industry is the consistent insistence of Dazu Optoelectronics."
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