More and more industrial and communications applications benefit from non-isolated DC/DC power module products, including reliability, size, etc. These benefits help to reduce time-to-market for end products, and terminal companies do not have to Complex power supply design development. The DC/DC power module enhances product portability and reduces product size. The standard power module integrates passive components, inductors, MOSFETs, and controllers to provide a complete, fully integrated solution in a standard package that covers the complete current and voltage range at an affordable price.
The power module combines most of the necessary components to provide a plug-and-play solution that replaces more than 40 different components. This integration simplifies and speeds up the design of the system, and it also significantly reduces the board area occupied by the power management portion. In order to achieve the required voltage accuracy, these power modules are typically placed near the chip circuitry on the board that requires power. But as systems become more complex, layouts are even more important in systems with higher currents, lower voltages, and higher frequencies.
The most common non-isolated DC/DC power modules are single in-line package (SIP), open frame construction. They obviously bring convenience to engineers and simplify the design of the system. But in general they are only suitable for designs with lower switching frequencies, such as 300 kHz or lower. Moreover, their power density is usually not optimized, especially compared to DC/DC chip scale modules.
When evaluating different power modules, engineers must compare the characteristics of various power modules for their specific application, including the electrical, thermal performance, size, and reliability specifications of the module to determine whether to use a traditional module or have A new high-density module with the best thermal resistance.
Chip-scale packaged DC/DC module
The newest modules are fully packaged DC/DCPOL digital power modules that combine all the benefits of a digital power solution with PMBus and a fully packaged approach. With an internal digital controller, PMBus can be used to set various parameters to meet the needs of a particular application. Various parameters can be monitored and stored in the on-board memory. In the most advanced modules available, almost all discrete components are integrated into the module. Benefits include reduced time to market, streamlined devices on printed circuit boards, and enhanced long-term reliability. In this fully packaged approach, the bottom of the package provides a larger area of ​​thermal pad, enhanced heat dissipation, pin on the package edge, and ideal solder joint inspection. This module can operate at 3.3V, 5V, 12V bus input voltage, provide 0.54V ~ 4V step-down output, with a single resistor setting, and up to 12A output current capability, fully packaged digital power modules can provide multiple combinations To meet a wide range of application needs.
One of the main advantages of a fully packaged digital power module is the increase in power density, which is achieved by improving the heat dissipation of the package. Power density and thermal resistance are closely related, especially for higher power solutions greater than 25W. In the past few decades, the semiconductor industry has been competing to improve power density/integration. The most basic reason is that the system is more and more powerful and requires more components, but the size of the entire system must be reduced. Maintain competitiveness. As a result, the size of the component/solution is the key to this trend, which means customers can load more things and a stronger/larger power processor on a smaller board, such as a server. This is the case with applications or automated test equipment. Obviously, the lower the thermal resistance, the higher the power density. Some power module products cannot achieve higher power because of the thermal resistance of the package. Furthermore, the better the thermal efficiency of the solution, the less the user needs to worry or the design constraints, such as having to determine a sufficient amount of airflow, or adding heat sinks. In the reinforced QFN package, there is a large thermal pad on the bottom of the package, and the enhanced package outer mold material can be used as a heat sink, which contributes to the optimal thermal performance of the fully packaged power module (Figure 1). .
Figure 1. The advantages of the heat dissipation effect in a fully packaged module.
Very low thermal resistance interpretation, thermal resistance from the core of the chip to the atmosphere (juncTIonto-ambient) 11.5C / W, and the core of the chip to the bottom of the package (juncTIon-to-case) thermal resistance 2.2C / W There is a glimpse into it. This performance determines the solution that can be designed with higher power in a smaller size. Since the package's core-to-pad thermal resistance is so low, most of the heat will diverge through the bottom of the package. Compared to modules with an open architecture, this power module can operate at full load over the full industrial temperature range without any airflow. The heat dissipation capability of the module package can be considered to be a significant impact on the ability to achieve higher power densities than traditional open architecture modules or discrete power solutions, and allows fully packaged modules to be the best alternative to other modules.
The fully packaged module solution offers greater reliability and manufacturability. For example, since all components are completely encapsulated, there is better electrical isolation from the outside world; fewer solder joints, so solder joint damage over time is reduced; less chances for specific applications due to pressure Rupture, in addition, is more suitable for traditional automatic placement machine production than non-planar open architecture solutions.
In addition to full packaging, this module has the advantage of being able to configure and monitor the power system using PMBus and I2C interfaces. The best way to take advantage of these benefits is through a simple graphical user interface (GUI) that allows design engineers to adjust various operating parameters such as soft-start time, output voltage margin, voltage tracking, and PowerGood signals. No external circuitry is required to use this method, and its design is flexible enough to meet current and future design needs.
Whether in the development phase or in the application phase, various parameters of the system can be monitored. For example, the output status, voltage, and current can be monitored and stored in non-volatile memory, plus the date, which can be read externally when needed. This intelligent power supply makes the performance of the whole system superior, while system monitoring ensures long-term reliability. The monitored data is saved and the failure analysis process is simplified. Once the digital power module is configured internally in a specific application, this configuration Documents can be read and copied to other identical products through the configuration program.
Intersil's ZL9101MIRZ is one example of the latest DC/DC fully packaged power module that combines next-generation packaging and digital power management technology to dramatically reduce external components and simplify the design of complex POL power supplies. It offers better reliability than traditional open architecture modules or discrete solutions, and dramatically reduces design cycles and time to market. It is designed and monitored using the graphical interface PowerNavigator software for easier operation.
In some cases, a fully packaged module can achieve four times the power density of a normal module. For example, compared to the ZL9101MIRZ and the open architecture module on the market, the ZL9101M has a power density of 38W/cm3 (8.6W/cm3 for common modules), and its board area on the circuit board is also small, 2.2cm2 for ordinary The module's 3cm2 has a gap of about 30%. This is very important when the board space is extremely small.
In general, packaged digital power module technology combines next-generation packaging technology with easy-to-use digital power technology to simplify POL power supply design with minimal external components, providing more open architecture power modules or discrete solutions. High reliability and a drastic reduction in design cycles.
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