Announcement of Bidding for Teaching Equipment Purchase Project of Multifunctional Computer Lab of Jiangxi Normal University

Entrusted by Jiangxi Normal University, the procurement of multi-functional computer lab teaching equipment (bidding number: JXNC2016G033), according to Jiangxi Provincial Government Procurement Office procurement 2016 department approved open tender procurement, welcome domestic qualified suppliers before Come to participate.

1, the procurement method: open tender
2. Contents of the bidding project and procurement budget:
Purchase Item No. Procurement Item Name Unit Quantity Purchase Budget
(10,000 yuan) Specifications and technical parameters
赣购2016B008988002 Multifunctional Computer Lab Teaching Equipment Batch 1 71.2 See Technical Specifications and Requirements
The "Multifunctional Computer Laboratory Teaching Equipment" batch includes the following products:
Item No. Item Unit Quantity
1 Teacher's kit 1
2 Back-end server system set 4
3 Electronic Classroom Software Set 1
4 Smart Terminal System Set 80
5 Switch Station 2
6 Network Cabinets Set 1
7 Teacher's Headset 1
8 Student Headphones Set 80
9 LCD Display 1 Set 300
10 LCD Monitors 2 Sets 10
11 Examination Services Computer Set 4
12 Laptop Desk 2
13 Software 1 Set 1
14 Software 2 Sets 1
15 Software 3 Sets 10
16 Software 4 Set 1
17 Software 5 Sets 10
18 Labor and auxiliary materials batch 1
Note: The above products are domestic products.
3, bidders must have the following qualifications:
(1) Enterprises with independent legal personality and capable of providing corresponding services;
(2) Having a good record of paying taxes and social security funds according to law;
(3) In the three years prior to participating in government procurement activities, there was no major violation record in business activities.
6. The bidding documents must be at 09:30 on December 5, 2016 (Beijing time)

Metal Base Circuit Board

The copper base board is the most expensive one among the metal substrates, and the heat conduction effect is many times better than that of the aluminum substrate and the iron substrate. It is suitable for high-frequency circuits and regions with high and low temperature variations and the heat dissipation and architectural decoration industries of precision communication equipment.

Generally, the finishing include ENIG, immersion silver, LF HASL, OSP, etc. The copper substrate circuit layer is required to have a large current carrying capacity, so a thick copper foil should be used, and the thickness is generally 35 μm to 280 μm; the thermal conductive insulating layer is the core technology of the copper substrate, and the core thermal conductive component is aluminum oxide and silicon powder. It consists of a polymer filled with epoxy resin, low thermal resistance (0.15), excellent viscoelasticity, resistance to heat aging, and ability to withstand mechanical and thermal stresses.

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