Wafer production tight IC design is difficult for

Although the domestic IC design factories have successively received orders from international mobile phone factories or computer manufacturers this year, due to the capacity of foundry factories, they were already wrapped by international IDM plants or large European and American IC design companies as early as the end of last year. Therefore, IC design The industry is now facing a shortage of wafer production capacity, and has affected wafer shipments in the first quarter.

It is understood that the utilization of Wafer TSMC and UMC has been fully loaded in March. As a result, more and more wafers are experiencing tight wafer production, including wireless network ICs, LCD driver ICs, and MOSFETs. (MOSFET), mobile phone baseband chip, niche type memory, CMOS image sensor, etc. According to Rayling, a maker of Netcom chipsets, it has already had less than enough fab capacity and has had an impact on shipments this season.

As the computer and mobile phone market started to adjust inventory in the middle of last year, the foundry's utilization rate in the third quarter of last year was loose. In the fourth quarter of last year, the semiconductor production chain began to respond to changes in wafer inventory, including TSMC, UMC and other companies. Average capacity utilization fell to 90%.

However, due to the closure of its own fab, IDM International began to switch orders to foundries, including international IC design companies including Qualcomm, Broadcom, Invista, and AMD. They are optimistic about this year’s smart phone and tablet market. Demand was booked in the first half of this year in November and December of last year. As a result, foundries such as TSMC, UMC, and the world’s most advanced production capacity have been largely covered by major international customers in the first half of the year.

Due to the small scale of domestic IC design companies, coupled with the significant appreciation of the Taiwan dollar, and the traditional off-season in the first quarter, in order to reduce the pressure on the inventory, the wafer fab has not booked production operations in advance. Since the beginning of this year, sales of new electronic products for the Chinese New Year holiday have reached new heights, leading to the early completion of wafer inventory. Therefore, mainland mobile phone factories and computer factories have started to place orders for Taiwanese IC design plants, but IC designers are due to begin to start wafer manufacturing at the end of January. When it was time for production capacity, it was discovered that the production capacity was already taken away by international giants. Therefore, although full orders are now available, there is not enough capacity to ship.

Although wafer foundries such as TSMC, UMC, and the world’s most advanced companies have continued to expand their production capacity this year, their production speeds are still not able to catch up with orders. Therefore, they include 0.3-0.5 micron analog process, 0.13-0.18 micron high-voltage process, and 90 nanometers. With the following advanced manufacturing processes, production capacity is now in short supply, and the supply gap in the second quarter is likely to increase. The industry said that after March, it will repeat the drama of line-up production capacity in the first half of last year.

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Guangzhou Baiyun Shijing Quanchutong Electronic Factory , http://www.gztouchpanel.com

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