Keyword: PCB Resin Solution || PCB Copper || PCB Electrical || PCB Stencil The resin solution is actually a mixture of epoxy, curing agent and catalyst, combined with an organic solution, for impregnating the glass fiber cloth. The glass fiber cloth is dried at a temperature of 120 ° C to 170 ° C for 2 to 15 minutes after being impregnated into a prepreg having a plurality of voids with a thickness of 0.04 mm to 0.3 mm. The resin content of the prepreg is usually 30% or more. Resin film has high thermal conductivity This is a resin film with an inorganic filler added to a thermosetting, highly thermally conductive inorganic filler. The application resin is actually a prepreg resin and curing agent system with multiple voids. Inorganic fillers come in many categories and sizes. For example, alumina (Al 2 O 3) powder, aluminum nitride (AlN) powder, silicon dioxide (SiO 2) powder, silicon nitride (SiN) powder, and boron nitride (BN) powder may be used to conduct high thermal conductivity And, it is possible to apply organic fillers with excellent insulation properties. Alumina (Al 2 O 3) powders are well suited for this application, and if an oxidation treatment is used, an oxide film can be formed on the surface of the powder particles, which is advantageous for improving the moisture resistance product.